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PC Waffle Pack Chip Trays For Optoelectronics Industry Loaded

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PC Waffle Pack Chip Trays For Optoelectronics Industry Loaded

Brand Name : Hiner-pack

Model Number : HN21064

Certification : ROHS SGS

Place of Origin : CHINA

MOQ : 1000 pcs

Price : $0.35~$0.85(Prices are determined according to different incoterms and quantities)

Payment Terms : T/T

Supply Ability : 4500~5000pcs/per day

Delivery Time : 6~8 working days

Packaging Details : It depends on the QTY of order(500PCS/20KG/50*40*30CM)

Material : PC

Temperature : 60~80°C

Accessories : Cover & Clip

Color : Black

Matrix QTY : 20X20=400PCS

Surface Resistance : 1.0x10E4~1.0x10E11Ω

Clean Class : General And Ultrasonic Cleaning

Incoterms : EXW,FOB,CIF,DDU,DDP

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PC Waffle Pack Chip Trays For Optoelectronics Industry Loaded

 

Customized Waffle Pack For Optoelectronics Industry Loaded With Microlenses

 

Waffle pack is widely used in semiconductor, photoelectric industry customers of the product requires a high degree of cleanliness and size, we from the design drawings, mold manufacturing, product manufacturing to cleaning packing and so on, all of the steps and operations through strict quality control, to deliver the ultimate goal of customer satisfaction for product, continuously meet the customer's requirements, To promote our factory to a higher level of progress.

 

Waffle pack compared with other method has many advantages, it can be placed not only very tiny components or parts, and the flexibility to match the lid and clip to raise product real ease of use, can satisfy the customer the different demand for samples and production loading respectively, at the same time can also be applied to automated production, easy to use and save the packaging cost.

 

Advantages

 

1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japan...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.

 

Outline Line Size 101.6*101.6*4.5mm Brand Hiner-pack
Model HN21064 Package Type Tiny lenses
Cavity Size 2.4*2.4*0.45mm Matrix QTY 20*20=400PCS
Material PC Flatness MAX 0.3mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

 


Product Application

 

IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc

PC Waffle Pack Chip Trays For Optoelectronics Industry Loaded

FAQ

 

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

PC Waffle Pack Chip Trays For Optoelectronics Industry Loaded

For more information, please contact our sales department

 

Hiner-Pack 4 Inch Waffle Pack Catalogue.pdf


Product Tags:

PC Waffle Pack Chip Trays

      

Industry Waffle Pack Chip Trays

      

Industry die waffle pack

      
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