Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used For Electronic Modules And Chips

Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used  For Electronic Modules And Chips

Technical Parameters:

Applications:

• Semiconductor manufacturing: In the semiconductor production process, chip trays (Waffle Pack) are used to store and transport silicon wafers, ensuring safety during the processing and testing stages.
• Packaging and assembly: During the chip packaging and assembly process, a chip tray (Waffle Pack) helps maintain the neatness and safety of the chips, reducing the risk of damage.
• Automation equipment: Used in conjunction with automated production equipment to ensure accurate positioning and processing of chips during the automation process.

Features:

• Stackability: Stackable design facilitates storage and transportation, saves space, and improves management efficiency.
• Lightweight: Lightweight design, easy to operate and transport, suitable for laboratory and small batch production.
• High-precision: Accurate mold manufacturing ensures stable fixation of chips, reducing displacement and collision risks.

Support and Services:

• Customized design: Provide customized chip tray designs based on customer-specific needs, including dimensions, shapes, and materials.
• Quality inspection: Strict quality control and testing are carried out on chip disks to ensure that each product meets industry standards.
• Technical Support: Provide technical consultation and support to help customers choose suitable chip disks and solve problems during use.